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Non resettable fuses
www.schurter.com/PG01_2
Surface Mount Fuse, 5 x 20 mm, Time-Lag T, L, 250 VAC, Au plating
IEC 60127-2 · 250 VAC · Time-Lag T
Description
- Directly solderable on printed circuit boards
- L = Low Breaking Capacity
- For rated current 1 A to 16 A, SMD-SPT is recommended
Standards
- IEC 60127-2/3
- UL 248-14
- CSA C22.2 no. 248.14
Approvals
- VDE Certificate Number: 40011522
- UL File Number: E41599
Technical Data
SMD-FST
Applications
- Primary protection on SMD PCBs
References
Packaging Details
Weblinks
pdf-datasheet , html-datasheet , General Product Information ,
Approvals , CE declaration of conformity , RoHS , CHINA-RoHS , e-Shop ,
SCHURTER-Stock-Check , Distributor-Stock-Check , Detailed request for
product
Rated Voltage
Rated current
Breaking Capacity
Characteristic
Mounting
Admissible Ambient Air Temp.
Climatic Category
Material: Housing
Material: Terminals
Unit Weight
Storage Conditions
Product Marking
250 VAC
0.05 - 20 A
35 A - 125 A
Time-Lag T
PCB,SMT
-55 °C to 125 °C
55/125/21 acc. to IEC 60068-1
Glass
Gold-Plated Copper Alloy
1.05 g
0 °C to 60 °C, max. 70% r.h.
, Current, Dielectric strength, Cha-
racteristic, Breaking Capacity
Soldering Methods
Solderability
Resistance to Soldering Heat
Resistance to Vibration
Load Humidity Test
Moisture Resistance Test
Terminal Strength
Thermal Shock
Reflow
245 °C / 3 sec acc. to IEC 60068-2-58,
Test Td
260 °C / 10 sec acc. to IEC 60068-2-
58, Test Td
acc. to IEC 60068-2-6, test Fc
MIL-STD-202, Method 103B
0.1 x In @ 0.85 r.H. @ 85°C
MIL-STD-202, Method 106E
(50 cycles in a temp./mister chamber)
MIL-STD-202, Method 211A
Deflection of board 1 mm for 1 minute
MIL-STD-202, Method 107D
(200 air-to-air cycles from -55 to
+125°C)
Case Resistance
Resistance to Solvents
acc. to EIA/IS-722, Test 4.7
>100 M Ω (between leeds and body)
MIL-STD-202, Method 215A
Dimension
10 ±0.2
20 mm
20 ±0.5
Soldering pads
5.5
Fuses
9.5
5.5
1
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